Li, Dandan; Wang, Chengyang; Ma, Shengqi; Zhou, Hongwei; Lu, Ran published the artcile< Preparation and characterization of soluble heat-resistant polyimide films containing bis-N-phenyl-benzimidazole>, Related Products of 4415-87-6, the main research area is polybenzimidazole imide heat resistant film thermomech property.
To prepare soluble polyimides with high temperature resistance, two new diamine monomers, namely, 2,2′-(4,4′-oxybisphenylene)-bis(1-phenyl-5-aminobenzimidazole) (5a), and 2,2′-(4,4′-hexafluoroisopropylidene)-bis(1-phenyl-5- aminobenzimidazole) (5b), were synthesized and exploited to prepare three series of poly(benzimidazole imides)s (PBIIs) by a conventional two-stage synthesis. The resulting PI films were flexible and tough, possessing high glass-transition temperatures (Tgs = 311°C-390°C), improved optical transparency, and excellent solubility Moreover, the effect of different configuration on performance was revealed, and these data provided a feasible method to enhance both Tg and solubility of PIs by incorporating N-Ph benzimidazole and corresponding functional moieties.
High Performance Polymers published new progress about Complex modulus, tan δ. 4415-87-6 belongs to class tetrahydrofurans, and the molecular formula is C8H4O6, Related Products of 4415-87-6.
Referemce:
Tetrahydrofuran – Wikipedia,
Tetrahydrofuran | (CH2)3CH2O – PubChem