Copper cleaning and protection formulations was written by Koji, Yukichi; Hirashima, Ryoichi; Saito, Hideaki. And the patent was published on September 19,2013.Category: tetrahydrofurans The following contents are mentioned in the patent:
A cleaning composition for cleaning post-chem. mech. polishing residue and contaminants from a microelectronic device without compromising the low-k dielec. material or the copper interconnect material comprises at least one solvent, at least one corrosion inhibitor, at least one polyamine species, and at least one quaternary base, wherein the at least one polyamine species is at least one of an aliphatic polyamine or a cyclic polyamine. A composition for cleaning copper wire semiconductors (removing benzotriazole residue) comprises 0.7 weight% triethanolamine, 0.03 weight% gallic acid, 0.16 weight% tetramethylammonium hydroxide and 99.1 weight% water. This study involved multiple reactions and reactants, such as (2R,3S,4R,5R)-2-(Hydroxymethyl)-5-(9H-purin-9-yl)tetrahydrofuran-3,4-diol (cas: 550-33-4Category: tetrahydrofurans).
(2R,3S,4R,5R)-2-(Hydroxymethyl)-5-(9H-purin-9-yl)tetrahydrofuran-3,4-diol (cas: 550-33-4) belongs to tetrahydrofuran derivatives. Tetrahydrofurans and furans are important oxygen-containing heterocycles that often exhibit interesting properties for biological applications or applications in the cosmetic industry. THF (Tetrahydrofuran) is also used as a starting material for the synthesis of poly(tetramethylene ether) glycol (PTMG), etc.Category: tetrahydrofurans
Referemce:
Tetrahydrofuran – Wikipedia,
Tetrahydrofuran | (CH2)3CH2O – PubChem